I will design high speed multilayer hdi pcb and bga boards

I will design high-speed, high-density HDI PCBs for complex electronics, including wearable SoC evaluation boards. My work covers BGA routing (0.35mm pitch), multi-layer PCB layout, schematic creation, BOM preparation, 3D modeling, and fabrication-ready files.

Whether you need a 12-layer HDI PCB with advanced interfaces like 4G, NFC, WLAN, or MIPI CSI, I provide precise, reliable, and optimized designs using Altium Designer.

Youll receive professional hardware engineering, accurate layouts, and ready-to-manufacture files for your high-performance electronics projects.