Firmware reliability: Writing robust control code with libraries and fail-safes to handle unexpected conditions.
Enclosure and thermal considerations: Planning connectors, cable routing, and heat management upfront to reduce iteration later.
To hit the ground running, it would be helpful to know:
Any existing schematics, sketches, or BOMs you already have.
Specific sensors, modules, or components you prefer or require.
Enclosure constraints, if already chosen (size, material, connectors).... Lee más